WLCSP (Wafer Level Chip Scale Pac廠朋kaging) is new develo筆能ped technology differe劇公nt from traditional packaging proc了知ess, which is to complete testing on 相技wafer. Thus, smaller outlines and大筆 high density can be effectively achiev下錢ed. lt enables high speed and 時雜stable data transfer站大ring. TwinSolution develops a煙內nd provides perfect WLCSP test interf一票ace solutions.

● Broad range of spr錢睡ing pins options for tar公看geted application, with pitch 畫數ranging 200 - 650 um

● Special designed terna場低ry alloy tip for maximum lifetime

● Replaceable individual probes f南兵or easy maintenance

● 5G mm Wave band support

● SAW filter ultra-low induc風要tance design

● Nano surface coating tech紙到nology enable solder migration 舊能free for contact sensitive弟拍 device.

● Patented Super-Hard coating信問 film high wear resistance 計笑application