● Varies 4-point crown de坐算sign enable“scrub”, for less這視 soldermigration
● Jamming prevention
● Automatic thermal control
● Lean design with c好多ost performance, Semi-M拿為olded burn in socket
● Quick turn round fo有街r small volume engineer線國ing validation
● Capable for large scale BGA array.近錢
● BGA QFN QFP Application
● High temperature: 155
Key reliability test which include HTO見鐘L/LTOL, HAST,HTSL,THB, etc
● By using conductive materi湖時al build socket body to provide a uni木劇form grounding redist工兒ributionregardless of customer pi厭弟n map assignment.
● Take full advantage of air as t火數he dielectric media to get a bet男妹ter signal transmission effici金們ency.
● Pitch range from 0.4mm,0.5m風開m,0.65mm,0.8mm, 1.Omm,1.27mm……
● Up to 84GHz bandwidth,112Gb老鐵ps PAM4 transmission在筆 speed
● Adjustable differen媽訊t impedance control for 來鐘different signal, etc器船.
● Great EM shielding performance,購中 from board to DUT
● A composite material can do better 行得than any single alloy低購, measured value for single spri些媽ng ~ 500 mΩ but when made as comp站但osite ~ 100mΩ
● High CCC up to 800mA
● Pitch down to 80um
● Large pin count up to人得 10000+
● Nearly invisible probe mar線了k
● Best co-planarity
● Good temperature b線吧ehavior(-40℃ to 125℃)
● Low contact force , no risk城姐 for the CUP
padProbe 生外head spacer design to 很為extend test lifetime
● Simple design , easy e商雨xchange of needles and can be do弟短ne onsite
● Replaceable test hea器靜d
WLCSP (Wafer Level Ch算山ip Scale Packaging) i知聽s new developed technology differe森小nt from traditional packag小一ing process, which is to體日 complete testing on wafer. Thus, s刀聽maller outlines and hig務不h density can be effectively achieved. 笑家lt enables high speed a煙還nd stable data transferring. TwinSol友林ution develops and provides per放跳fect WLCSP test interface solutions分低.
● Pitch scalability to 80um.妹雜
● Best-in-class Plan月刀arity
● Multiple Space Transformation 媽飛Options
● High Pin-Count & Multi-S事那ite: >3000 Probes.
● Low-force probing for Low_K and CUP 音影pad.
● High-Current Solution:>1.0A
● Temperature: up to 150 de讀你grees Celsius
● Life span: more than 5000 ho風很urs / up to 5lots
● High Layer Count (50+)
● High Aspect Ratio (36:1 +)
● Dual Lamination
● Mix Lamination
● Impedance Control (± 5%)
● Special construction using m線愛ixed laminates
● 12X19 to 24X30 inc我睡hes panel
● Supported template include: V93K-9.技還5/12, V93K-DD, V5400, J75我謝0, Ultraflex, Ultraflex DD, etc.
● Automatic test machines i什門nclude:93k、J750、UFlex、Chroma、Acc煙著otest、etc
● Number of layers: 50+
● Frequency: 10Ghz+
● Pad spacing: 200um
Serviceable range:
BGA/LGA Test Socket (Both Final test a務時nd R&D purpose)
Advantage:
High Data Speed performance
High Current Capacity performanc你著e
Cost Effective
Better Final Test Yield
● Automatic testing Automatic testi雨員ng and installation.
Mode A: Bin1/NG mate為這rial distribution tray
Mode B: T化為ray in & Tray Maping雨媽
● Presoaking. Can prehe讀內at the chip . (Optional configurat睡自ion)
● QR code reading. (Optional con會通figuration)
● Multi-tray design, suitable for long你見-term unmanned testing.
● The test head is repla民報ceable and suitable for a 銀吧variety of products.
Pre-sales / General Contact:CSR@twins風答olution.com
Tel:86-0512-67069909
After-Sales Service:FAE@twinsolution.村哥com
Copyright © Shanghai TwinSolution Technol得哥ogy Co. All rights rese我愛rved Support:bomin